Electroless Nickel (Selection)

HESSONIC PN 2000  

• Electroless pre-nickel process 
• Operates at 35 °C 
• Very steady mode of operation 
• Very good adhesion properties 
• Particularly well suited in case of very high production shares of aluminium  

HESSONIC GR   

• Phosphorus content of 5 - 9% 
• Only one make-up solution 
• Complies with the standards MIL-C-26074D and AMS 2424  

HESSONIC M-20  

• Phosphorus content of 5 - 9% 
• Only one make-up solution 
• Complies with the standards MIL-C-26074D and AMS 2424 
• Can be operated with self-adjusting pH-value  

HESSONIC EN-4   

• Phosphorus content of 5 - 9% 
• Only one make-up solution 
• Without lead  and cadmium
• Complies with the standards MIL-C-26074D and AMS 2424  

HESSONIC HP-8   

• Phosphorus content ≥ 10% 
• Compliant to RoHS, WEEE and ELV 
• Very steady process  

HESSONIC HP-9   

• Phosphorus content ≥ 10% 
• Compliant to RoHS, WEEE and ELV 
• Process for outstanding corrosion protection 
• Very steady process 
• Without lead and cadmium      

HESSONIC HP-10   

• Phosphorus content ≥ 10% 
• Compliant to RoHS, WEEE and ELV 
• Process for outstanding corrosion protection 
• Very steady process    

HESSONIC HP-6   

• Depending on the operation mode, the phosphorus content can be adjusted to 6 - 9% or ≥ 10% 
• Only one make-up solution 
• Compliant to RoHS, WEEE and ELV  

Hard chrome

HESSOCHROM HC-80 

• Produces micro cracked layers 
• Layer thickness >1000 HV 
• High deposition rate
• Good throwing power

Tin

SOLAR 600 C   

• Sulphuric process 
• For technical as well as decorative surfaces 
• Good solderability 
• For rack application as well as barrel application  

SOLAR 850 HC   

• MSA-based process 
• For high speed plating of electronic components 
• Good solderability 
• For belt conveyor systems, strip and wire-plating applications